RISC-V Summit: Customisable vector unit
Vector unit are composed of several vector cores that perform multiple calculations in parallel.
X-Fab offers 110nm BCD-on-SoI process
Called XT011, it “reflects the need for greater digital integration and processing capabilities within analogue applications”, said X-Fab, claiming: “It brings together the appealing attributes associated with both SoI and DTI [deep trench isolation], so that high-density digital logic and analogue functionality can be more easily incorporated in a single chip compared to traditional bulk…
UL-certified recycled ABS polymer for electronics and vehicles
‘ABS 4125 UL’ is UL certified and contains ≥95% post-consumer recycled content, derived from the waste electronics sector. It is already being exported to the USA and Hong Kong.
Multi-stage miniature thermoelectric coolers
MSX Series have cold-side footprints down to 2 x 4mm, and thicknesses down to 3.3mm for two stages, 3.8mm for three stages and 4.9mm for four-stage coolers.
NXP top-side-cooled RF amplifiers for smaller lighter 5G basestations
It is aiming at active MIMO (multiple input multiple output) antenna arrays, where using a top-side cooled amplifier (‘PA’ upside-down in diagram right) allows all heat to be extracted from one side of a simple PCB, leaving its other side available for the antennas.
AMD to supply Spartan 6 FPGAs to 2030 at least
The programmable ICs were introduced originally in 2009.
Thermal interface material flows fast for production
Called GEL 60HF (HF = high flow), long-term thermal stability is claimed by the company, as are properties suited to re-work and field repair.