Electronic Manufacturing Equipment

Electronic Manufacturing Equipment

X-Fab offers 110nm BCD-on-SoI process

Called XT011, it “reflects the need for greater digital integration and processing capabilities within analogue applications”, said X-Fab, claiming: “It brings together the appealing attributes associated with both SoI and DTI [deep trench isolation], so that high-density digital logic and analogue functionality can be more easily incorporated in a single chip compared to traditional bulk…