“The 3Xi-M110 V3 model delivers cycle times of more than twice as fast as previously possible and the accuracy provided is unparalleled,” claimed the company. “The system utilizes volumetric inspection to identify voids in multi-layer solder, THT assembly and BGA head-in-pillow issues, and defective component parts based on fillet position and other factors.”
“Customers now have the option to specify microlensing for their SPAD array camera,” according to the company. “The microlenses offer an improvement of more than 10x in effective fill-factor, enhancing the sensitivity of the camera for time-resolved measurements. This works well for low light applications such as imaging through scattering media, as well as for…
Little hard information is yet available, but the company has said there will be 12 variants with either silicon carbide mosfets or IGBTs.
Called PF1500B-360, it delivers that power with inputs from 170 to 265Vac, while 1kW is available when operating down to 85Vac. Input and output to base-plate isolation is 2.5kVac.
Free access will be retained, through a service called DesignSpark Explorer.
Called AL17051, versions are available to deliver 3.3V or 5V.
It is intended to conform to rough surface irregularities, displace air gaps, and take up manufacturing tolerances on. Bond lines as thin as 150μm can be accommodated.
With G3VM-401xY2 and G3VM-601xY2 base numbers, the 400V (120mAdc, or peak ac, continuous) and 600V (90mA) devices have typical on-resistances of 22 and 45Ω respectively with 5mA though the input led. Max figures are 35 and 60Ω, and resistances are a little lower for the first 1s of operation, according to the data sheet.
The part is BD7F205EFJ-C, and it will deliver up to 6W. When running from 12V, its internal switch can handle 3.8A.
Called SDS6000L, they are based on the display-inclusive SDS6000A series, and by adding a separate ‘synchronisation distributor’ unit, multiple scopes can be connected together for up to 64 synchronised analogue channels.