Electronic Manufacturing Equipment

Electronic Manufacturing Equipment

Tokyo Nepcon: In-line automated 3D x-ray inspection for production

“The 3Xi-M110 V3 model delivers cycle times of more than twice as fast as previously possible and the accuracy provided is unparalleled,” claimed the company. “The system utilizes volumetric inspection to identify voids in multi-layer solder, THT assembly and BGA head-in-pillow issues, and defective component parts based on fillet position and other factors.”

Electronic Manufacturing Equipment

Single photon counting camera gets more sensitive

“Customers now have the option to specify microlensing for their SPAD array camera,” according to the company. “The microlenses offer an improvement of more than 10x in effective fill-factor, enhancing the sensitivity of the camera for time-resolved measurements. This works well for low light applications such as imaging through scattering media, as well as for…